23 September 1996 Dry etching and micromachining of precision silicon components
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Proceedings Volume 2879, Micromachining and Microfabrication Process Technology II; (1996) https://doi.org/10.1117/12.251212
Event: Micromachining and Microfabrication '96, 1996, Austin, TX, United States
Abstract
Dry etching and micromachining with laser radiation of short wavelength and pulse length are investigated to present their process capabilities for the production of surface structures within precision silicon components. The laser dry etching processing with excimer laser radiation is modified by using a microwave-excited processing gas. Furthermore, methylmethacrylate is additionally used to study the influence of polymerization on the etched structures. The micromachining with frequency-doubled Nd:YLF laser radiation is performed yielding more precise structures during drilling and caving due to the lower heat and pressure load during the interaction time. The processes involved in dry etching and micromachining with laser radiation are studied by high-speed photography, mass spectroscopy and optical spectroscopy, whereas the produced structures are analyzed by profilometry, optical and electron microscopy as well as electron spectroscopy such as XPS and AES. The results are discussed in view of applications for surface patterning of precision silicon components.
© (1996) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Ernst-Wolfgang Kreutz, Ernst-Wolfgang Kreutz, Wilhelm Pfleging, Wilhelm Pfleging, David A. Wesner, David A. Wesner, Juergen Jandeleit, Juergen Jandeleit, G. Urbasch, G. Urbasch, "Dry etching and micromachining of precision silicon components", Proc. SPIE 2879, Micromachining and Microfabrication Process Technology II, (23 September 1996); doi: 10.1117/12.251212; https://doi.org/10.1117/12.251212
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