23 September 1996 Silicon-micromachined poppet valve with an octagonal diaphragm
Author Affiliations +
Proceedings Volume 2879, Micromachining and Microfabrication Process Technology II; (1996) https://doi.org/10.1117/12.251209
Event: Micromachining and Microfabrication '96, 1996, Austin, TX, United States
A new pressure-activated silicon micromachined poppet valve design and fabrication process are presented for automotive fuel applications. Although non-electrically activated, micromachining provides a physical structure which is difficult or expensive to achieve with conventional method machined parts. Bulk etching is used to fabricate an octagonal silicon diaphragm which moves in response to the inlet fluid pressure. Silicon direct bonding is used to combine two layers, one with an inlet flow chamber and valve boss, and a second with a movable diaphragm and valve seat. The outlet side of the diaphragm includes a spring locator to position a counter-force mechanical spring. The diaphragm's burst pressure is reduced and varies greatly depending on the alignment of the clamping edges above and below the diaphragm.
© (1996) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
James W Siekkinen, James W Siekkinen, K. J. Haltiner, K. J. Haltiner, Dan W. Chilcott, Dan W. Chilcott, L. X. Huang, L. X. Huang, Steve E. Staller, Steve E. Staller, } "Silicon-micromachined poppet valve with an octagonal diaphragm", Proc. SPIE 2879, Micromachining and Microfabrication Process Technology II, (23 September 1996); doi: 10.1117/12.251209; https://doi.org/10.1117/12.251209


Stress analysis of a standard CMOS process
Proceedings of SPIE (September 28 1999)
Pump it up
Proceedings of SPIE (April 03 2012)
Monolithic multiple axis accelerometer design in standard CMOS
Proceedings of SPIE (September 14 1995)
Micromachined cochlear-like acoustic sensor
Proceedings of SPIE (July 10 2002)

Back to Top