13 September 1996 Cyanoacrylate bonding of thick resists for LIGA
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Proceedings Volume 2880, Microlithography and Metrology in Micromachining II; (1996) https://doi.org/10.1117/12.250949
Event: Micromachining and Microfabrication '96, 1996, Austin, TX, United States
Abstract
The MicroSystems Engineering Team ((mu) SET) at Louisiana State University, in close collaboration with the Center for Advanced Microstructures and Devices, has successfully completed the lithography and electroplating steps of the LIGA process sequence using cyanoacrylate to bond a PMMA resist layer to a nickel surface. Nickel microstructures 300 micrometers in height have been electroplated. Tests were performed which indicate that the bond between cyanoacrylate and nickel is much stronger than the bond between PMMA and nickel.
© (1996) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
James G. Rogers, James G. Rogers, Christophe Marques, Christophe Marques, Kevin W. Kelly, Kevin W. Kelly, Venkat Sangishetty, Venkat Sangishetty, Chantal G. Khan Malek, Chantal G. Khan Malek, "Cyanoacrylate bonding of thick resists for LIGA", Proc. SPIE 2880, Microlithography and Metrology in Micromachining II, (13 September 1996); doi: 10.1117/12.250949; https://doi.org/10.1117/12.250949
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