13 September 1996 Fabrication of mm-wave undulator/linear accelerator cavities using deep x-ray lithography
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Proceedings Volume 2880, Microlithography and Metrology in Micromachining II; (1996); doi: 10.1117/12.250963
Event: Micromachining and Microfabrication '96, 1996, Austin, TX, United States
Abstract
The possibility of fabricating mm-wave radio frequency cavities using deep x-ray lithography (DXRL) is being investigated. The frequency of operation can be from 30 GHz to 300 GHz, operating mode in either TM or TE-mode, depending on the application. For most applications, a complete structure consists of two mirror-image planar half structures assembled face-to-face. The fabrication process includes manufacture of precision x-ray masks, exposure of positive resist by x-rays through the mask, resist development, and electroforming of the final microstructure. The precision hard x-ray mask was made by means of an surface mask, using soft x-ray lithography for pattern transfer into poly-methylmethacrylate (PMMA) on a 200-micrometers thick Si wafer, followed by electroplating of 35-micrometers Au at CXrL (Center of X-ray Lithography) in Wisconsin. For the DXRL process, PMMA was used as the positive resist, either as an 1-mm sheet glued or 200-micrometers film cast onto a Cu substrate. The NSLS (National Synchrotron Light Source) X- 26C beamline in Brookhaven was used to expose the resist. 99.9% OFC (oxygen free copper) was electroplated onto the developed PMMA structure, and then polished by the diamond- lapping. The cavity will be aligned with the optical fibers on the grooves and then initial test will be performed with HP 8510 network analyzer.
© (1996) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Joshua J. Song, Y. W. Kang, Robert L. Kustom, Barry P. Lai, Derrick C. Mancini, A. Nassiri, V. White, "Fabrication of mm-wave undulator/linear accelerator cavities using deep x-ray lithography", Proc. SPIE 2880, Microlithography and Metrology in Micromachining II, (13 September 1996); doi: 10.1117/12.250963; https://doi.org/10.1117/12.250963
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KEYWORDS
Polymethylmethacrylate

X-ray lithography

Photomasks

Copper

X-rays

Hard x-rays

Photoresist processing

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