13 September 1996 Measurements of stress-strain diagrams of thin films by a developed tensile machine
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Proceedings Volume 2880, Microlithography and Metrology in Micromachining II; (1996) https://doi.org/10.1117/12.250960
Event: Micromachining and Microfabrication '96, 1996, Austin, TX, United States
Abstract
Mechanical properties of titanium thin films of 0.5 micrometers thickness and aluminum thin films of 1.0 micrometers thickness, microfabricated by magnetron spattering, were measured by using a novel tensile machine. These thin films are extremely difficult to handle because they are very fragile, so the thin film specimens were fabricated by using semiconductor manufacturing technology in a silicon frame to protect them. The test section of these specimens was 300 micrometers in width and 1400 micrometers in gauge length. By gripping the thin film specimen with a new device using a micrometer, it could be mounted on the tensile machine easily. The stress-train diagrams of both thin films were measured continuously from elastic deformation to plastic deformation in the atmosphere at room temperature. The experimental results indicated that the titanium thin film and the aluminum thin film had a smaller breaking elongation although they had a larger tensile strength than bulk pure titanium and bulk pure aluminum, respectively.
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Hirofumi Ogawa, Hirofumi Ogawa, Yuichi Ishikawa, Yuichi Ishikawa, Tokio Kitahara, Tokio Kitahara, Shinji Kaneko, Shinji Kaneko, } "Measurements of stress-strain diagrams of thin films by a developed tensile machine", Proc. SPIE 2880, Microlithography and Metrology in Micromachining II, (13 September 1996); doi: 10.1117/12.250960; https://doi.org/10.1117/12.250960
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