17 September 1996 Stacked multichip-module technology for high-performance intelligent transducers
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Proceedings Volume 2882, Micromachined Devices and Components II; (1996) https://doi.org/10.1117/12.250712
Event: Micromachining and Microfabrication '96, 1996, Austin, TX, United States
Abstract
The development of a technology platform for advanced modular integration of integrated circuits and micromechanical transducers in space constrained applications is presented. This includes the development of a technology for vertical feedtroughs based on the use of electrodepositable photoresist, and the development of a technology for interconnecting transducer chips and circuit chips using eutectic solder bump bonding. Different topologies are considered.
© (1996) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Siebe Bouwstra, Siebe Bouwstra, } "Stacked multichip-module technology for high-performance intelligent transducers", Proc. SPIE 2882, Micromachined Devices and Components II, (17 September 1996); doi: 10.1117/12.250712; https://doi.org/10.1117/12.250712
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