30 September 1996 Wafer bonding technology and its applications in optoelectronic devices
Author Affiliations +
Proceedings Volume 2891, Integrated Optoelectronics; (1996) https://doi.org/10.1117/12.253172
Event: Photonics China '96, 1996, Beijing, China
The new optoelectronic integrated technology--wafer bonding is described. The results of wafer bonding and applications in several new types of optoelectronic devices are presented.
© (1996) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Zuhua Zhu, Zuhua Zhu, Guilan Ding, Guilan Ding, Kangsheng Chen, Kangsheng Chen, Felix Ejike Ejeckam, Felix Ejike Ejeckam, Yi Qian, Yi Qian, Gina L. Christenson, Gina L. Christenson, Yu-Hwa Lo, Yu-Hwa Lo, } "Wafer bonding technology and its applications in optoelectronic devices", Proc. SPIE 2891, Integrated Optoelectronics, (30 September 1996); doi: 10.1117/12.253172; https://doi.org/10.1117/12.253172

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