Evaluation of thin film by chemical vapor deposition using x-ray diffraction

J. T. Oh; Peter Hing; H. S. Fong

doi:10.1117/12.269860

20 March 1997 Evaluation of thin film by chemical vapor deposition using x-ray diffraction

J. T. Oh, Peter Hing, H. S. Fong

Proceedings Volume 2921, International Conference on Experimental Mechanics: Advances and Applications; (1997) https://doi.org/10.1117/12.269860
Event: International Conference on Experimental Mechanics: Advances and Applications, 1996, Singapore, Singapore

Abstract

X-ray diffraction techniques are increasingly being used for the evaluation of thin film in the microelectronics industries. The techniques use low angle scanning with an X- ray diffractometer. It is capable of determining the structure of the thin film material and its thickness on the substrate. X-ray diffraction techniques on thin film has the advantage over transmission electron microscopy that requires elaborate sample preparation which is time consuming, difficult and artefacts are often introduced during ion milling. In X-ray diffraction, the coated sample can be used without preparation. This paper discusses some recent advances in X- ray diffraction of thin films using parallel incident beam with a wide angle goniometer and a thin film attachment. It also discusses the results obtained on four materials coated with a thin film by chemical vapor deposition.

Citation Download Citation

J. T. Oh, Peter Hing, and H. S. Fong "Evaluation of thin film by chemical vapor deposition using x-ray diffraction", Proc. SPIE 2921, International Conference on Experimental Mechanics: Advances and Applications, (20 March 1997); https://doi.org/10.1117/12.269860

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