There is current interest, especially in the industrial sector, to use the digital speckle pattern interferometry (DSPI) technique to measure surface stress. Indeed, many publications in the subject are evident of the growing interests in the field. However, to bring the technology to industrial use requires the integration of several emerging technologies, viz. optics, feedback control, electronics, imaging processing and digital signal processing. Due to the highly interdisciplinary nature of the technique, successful implementation and development require expertise in all of the fields. At Baptist University, under the funding of a major industrial grant, we are developing the technology for the industrial sector. Our system fully exploits optical fibers and diode lasers in the design to enable practical and rugged systems suited for industrial applications. Besides the development in optics, we have broken away from the reliance of a microcomputer PC platform for both image capture and processing, and have developed a digital signal processing array system that can handle simultaneous and independent image capture/processing with feedback control. The system, named CASPA for 'cascadable architecture signal processing array,' is a third generation development system that utilizes up to 7 digital signal processors has proved to be a very powerful system. With our CASPA we are now in a better position to developing novel optical measurement systems for industrial application that may require different measurement systems to operate concurrently and requiring information exchange between the systems. Applications in mind such as simultaneous in-plane and out-of-plane DSPI image capture/process, vibrational analysis with interactive DSPI and phase shifting control of optical systems are a few good examples of the potentials.