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15 November 1996 Aging characterization of adhesives and bonded joints by nondestructive damping measurements
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Aging of adhesives is usually characterized by preparing standard bonded samples and destructively measuring shear, tensile or peel adhesion strength. Similarly the integrity of bonded devices is ascertained by destructive testing of duplicate samples, manufactured under identical conditions. The method requires a great number of samples in order to monitor the aging process. A new non-destructive testing method is suggested based on many experimentally determined correlations between the internal friction properties of materials and their strength, as a tool of characterizing the aging status of adhesives in bonded devices. Damping measurements we performed on simple flat and cylindrical joints made out of metallic adherents and various adhesives. The joints were aged in natural environments as well as through thermal accelerated treatments. Vibrations were introduced into the samples by a brief impact with an electromagnetic shaker and detected with a microphone. Special care was devoted to the fastening of the samples to insure reliable results. The NDT measurement results were corroborated by destructive shear tests of new and aged bonded joints. The results show that aging of adhesives can indeed be non-destructively characterized. Very good correlation was found between the specific damping capacity of the samples and the shear strength of the joints.
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Klara Shiloh, Avraham Eliahu, Avraham Rosenberg, Raphael Zilber, and Alisa Buchman "Aging characterization of adhesives and bonded joints by nondestructive damping measurements", Proc. SPIE 2944, Nondestructive Evaluation of Materials and Composites, (15 November 1996);

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