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15 November 1996 Use of dry-coupled ultrasonic inspection techniques for evaluation bondline quality
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Abstract
Adhesive bonding has been used for many years to mechanically connect components to various structures. The quality of the adhesive bond is primarily dependent upon the strength of the adhesive and of the interface between the adhesive and the adherent. Further, the strength of the interface is dependent upon a number of parameters, such as the area of adherence, cleanliness of the interface, and cure of the adhesive. There is difficulty in evaluating these parameters and the associated quality of the adhesive bond because the adhesive layer is sandwiched between two adhesively bonded layers and is not accessible for visual inspection. A number of nondestructive evaluation (NDE) techniques have been developed to prove the adhesive bond to determine the status of these physical parameters Ultrasonics is one of the most often in the form of liquid. Many manufacturers of adhesively bonded joints would like to avoid the use of liquid in the presence of the bondline. This is especially true when the bonded materials are hygroscopic.
© (1996) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Glenn M. Light and Edward A. Bloom "Use of dry-coupled ultrasonic inspection techniques for evaluation bondline quality", Proc. SPIE 2944, Nondestructive Evaluation of Materials and Composites, (15 November 1996); https://doi.org/10.1117/12.259049
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