27 March 1997 Processing parameters for laser micromachining
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Over a period of many years a wealth of information has been accumulated on processing parameters for laser micromachining of different materials. This information includes threshold fluences, etch rates versus fluence curves, taper effects, debris minimization and assist gas effects to name a few. It is the intent of the authors to compile this empirical information into an easily accessible catalog to be used as a reference guide for those interested in laser micromachining. Information will be included on material type, lasers used in machining (carbon-dioxide, solid state, excimer), laser processing parameters (wavelength, fluence, pulse width, cutting speed) and other material related information (thickness, feature sizes, etc.).
© (1997) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
James Angell, Wen Ho, Jeffrey S. Bernstein, Ronald D. Schaeffer, "Processing parameters for laser micromachining", Proc. SPIE 2993, Lasers as Tools for Manufacturing II, (27 March 1997); doi: 10.1117/12.270015; https://doi.org/10.1117/12.270015


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