27 March 1997 Processing parameters for laser micromachining
Author Affiliations +
Abstract
Over a period of many years a wealth of information has been accumulated on processing parameters for laser micromachining of different materials. This information includes threshold fluences, etch rates versus fluence curves, taper effects, debris minimization and assist gas effects to name a few. It is the intent of the authors to compile this empirical information into an easily accessible catalog to be used as a reference guide for those interested in laser micromachining. Information will be included on material type, lasers used in machining (carbon-dioxide, solid state, excimer), laser processing parameters (wavelength, fluence, pulse width, cutting speed) and other material related information (thickness, feature sizes, etc.).
© (1997) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
James Angell, James Angell, Wen Ho, Wen Ho, Jeffrey S. Bernstein, Jeffrey S. Bernstein, Ronald D. Schaeffer, Ronald D. Schaeffer, } "Processing parameters for laser micromachining", Proc. SPIE 2993, Lasers as Tools for Manufacturing II, (27 March 1997); doi: 10.1117/12.270015; https://doi.org/10.1117/12.270015
PROCEEDINGS
10 PAGES


SHARE
RELATED CONTENT

Advances In Excimer Laser Materials Processing: An Update
Proceedings of SPIE (April 25 1989)
Laser applications in advanced chip packaging
Proceedings of SPIE (March 13 2016)
Etching of polyimide by a Q-switched CO2 laser
Proceedings of SPIE (February 06 2000)
Overview Of The Industry And Future Trends
Proceedings of SPIE (March 15 1989)
Industrial Microprocessing Applications Of Excimer Lasers
Proceedings of SPIE (December 15 1988)
Industrial laser market
Proceedings of SPIE (July 31 1991)

Back to Top