Alignment-tolerant lasers and silicon waferboard integration

Mario Dagenais; Vijayanand Vusirikala; Scott A. Merritt; Simarjeet S. Saini; Robert E. Bartolo; Dennis Stone

doi:10.1117/12.271109

4 April 1997 Alignment-tolerant lasers and silicon waferboard integration

Mario Dagenais, Vijayanand Vusirikala, Scott A. Merritt, Simarjeet S. Saini, Robert E. Bartolo, Dennis Stone

Proceedings Volume 3005, Optoelectronic Interconnects and Packaging IV; (1997) https://doi.org/10.1117/12.271109
Event: Photonics West '97, 1997, San Jose, CA, United States

Abstract

Intrinsically large mode semiconductor lasers and mode transformers monolithically integrated with semiconductor lasers, are two promising approaches for making alignment tolerant structures that can be used for passive alignment to single mode optical fibers. This technique, in conjunction with a recently developed silicon waferboard integration scheme, will significantly simplify the assembly process and the packaging of transmitter laser arrays. The passive alignment technique consists of octagonal electrodeposited copper bosses to physically register the laser chip with percussion etched inverted pyramidal receptacles and v-grooves in a silicon substrate.

Citation Download Citation

Mario Dagenais, Vijayanand Vusirikala, Scott A. Merritt, Simarjeet S. Saini, Robert E. Bartolo, and Dennis Stone "Alignment-tolerant lasers and silicon waferboard integration", Proc. SPIE 3005, Optoelectronic Interconnects and Packaging IV, (4 April 1997); https://doi.org/10.1117/12.271109

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