4 April 1997 Alignment-tolerant lasers and silicon waferboard integration
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Abstract
Intrinsically large mode semiconductor lasers and mode transformers monolithically integrated with semiconductor lasers, are two promising approaches for making alignment tolerant structures that can be used for passive alignment to single mode optical fibers. This technique, in conjunction with a recently developed silicon waferboard integration scheme, will significantly simplify the assembly process and the packaging of transmitter laser arrays. The passive alignment technique consists of octagonal electrodeposited copper bosses to physically register the laser chip with percussion etched inverted pyramidal receptacles and v-grooves in a silicon substrate.
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Mario Dagenais, Vijayanand Vusirikala, Scott A. Merritt, Simarjeet S. Saini, Robert E. Bartolo, Dennis Stone, "Alignment-tolerant lasers and silicon waferboard integration", Proc. SPIE 3005, Optoelectronic Interconnects and Packaging IV, (4 April 1997); doi: 10.1117/12.271109; https://doi.org/10.1117/12.271109
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