Optical submount development for high-reliability/performance applications

Chad Noddings; Scott Rattan; Al Russo

doi:10.1117/12.271110

4 April 1997 Optical submount development for high-reliability/performance applications

Chad Noddings, Scott Rattan, Al Russo

Proceedings Volume 3005, Optoelectronic Interconnects and Packaging IV; (1997) https://doi.org/10.1117/12.271110
Event: Photonics West '97, 1997, San Jose, CA, United States

Abstract

MCC is currently applying a previously developed and patented optical submount approach for use in high- reliability/performance applications that include space, airframe, and outside telecommunication systems. The optical submount utilizes a novel alignment method integrated with low-cost, few-chip module packaging techniques originally developed for a laminate multichip module parallel link using vertical cavity surface emitting laser/optical electrical integrated circuit receiver arrays. This system is now being investigated for use in both single and parallel channel high-reliability/performance applications.

Citation Download Citation

Chad Noddings, Scott Rattan, and Al Russo "Optical submount development for high-reliability/performance applications", Proc. SPIE 3005, Optoelectronic Interconnects and Packaging IV, (4 April 1997); https://doi.org/10.1117/12.271110

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