Translator Disclaimer
Paper
4 April 1997 Optical submount development for high-reliability/performance applications
Author Affiliations +
Abstract
MCC is currently applying a previously developed and patented optical submount approach for use in high- reliability/performance applications that include space, airframe, and outside telecommunication systems. The optical submount utilizes a novel alignment method integrated with low-cost, few-chip module packaging techniques originally developed for a laminate multichip module parallel link using vertical cavity surface emitting laser/optical electrical integrated circuit receiver arrays. This system is now being investigated for use in both single and parallel channel high-reliability/performance applications.
© (1997) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Chad Noddings, Scott Rattan, and Al Russo "Optical submount development for high-reliability/performance applications", Proc. SPIE 3005, Optoelectronic Interconnects and Packaging IV, (4 April 1997); https://doi.org/10.1117/12.271110
PROCEEDINGS
4 PAGES


SHARE
Advertisement
Advertisement
Back to Top