22 January 1997 Wafer bonding technology and its optoelectronic applications
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Abstract
This paper describes the wafer bonding technology and its applications to optoelectronic devices and circuits. It shows that the wafer bonding technology can create new device structures with unique characteristics and can form integrated optoelectronic circuits containing optical, electronic and micro-mechanical devices.
© (1997) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Yu-Hwa Lo, Yu-Hwa Lo, Zuhua Zhu, Zuhua Zhu, Yi Qian, Yi Qian, Felix Ejike Ejeckam, Felix Ejike Ejeckam, Gina L. Christenson, Gina L. Christenson, } "Wafer bonding technology and its optoelectronic applications", Proc. SPIE 3006, Optoelectronic Integrated Circuits, (22 January 1997); doi: 10.1117/12.264243; https://doi.org/10.1117/12.264243
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