Wafer level thin-film solder bonding of a hybrid sensor for interfacial force microscopy

Carolyn M. Matzke; Jack E. Houston

doi:10.1117/12.271225

15 April 1997 Wafer level thin-film solder bonding of a hybrid sensor for interfacial force microscopy

Carolyn M. Matzke, Jack E. Houston

Proceedings Volume 3009, Micromachining and Imaging; (1997) https://doi.org/10.1117/12.271225
Event: Photonics West '97, 1997, San Jose, CA, United States

Abstract

We discuss the design, fabrication and performance of a hybrid force sensor for Interfacial Force Microscopy which features a new wafer-level, thin-film soldering technique.

Citation Download Citation

Carolyn M. Matzke and Jack E. Houston "Wafer level thin-film solder bonding of a hybrid sensor for interfacial force microscopy", Proc. SPIE 3009, Micromachining and Imaging, (15 April 1997); https://doi.org/10.1117/12.271225

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