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15 April 1997 Wafer level thin-film solder bonding of a hybrid sensor for interfacial force microscopy
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Abstract
We discuss the design, fabrication and performance of a hybrid force sensor for Interfacial Force Microscopy which features a new wafer-level, thin-film soldering technique.
© (1997) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Carolyn M. Matzke and Jack E. Houston "Wafer level thin-film solder bonding of a hybrid sensor for interfacial force microscopy", Proc. SPIE 3009, Micromachining and Imaging, (15 April 1997); https://doi.org/10.1117/12.271225
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