21 March 1997 Projection moire for 3D inspection of printed circuit boards
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Abstract
We present a method of projection moire specially devised for the three-dimensional inspection of printed circuit boards. This method incorporates phase-shifting technique in analyzing moire fringes so as to achieve a fine resolution of 1 micron in height measurement. Further a synchronous grating translation scheme enhances the lateral measuring resolution by inherently removing the original pattern of the reference grating in resulting moire fringes. Finally we discuss the advantages of the proposed method using several measurement results performed on the various types of solder paste silk-screened on printed circuit boards.
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Seung-Woo Kim, Seung-Woo Kim, Yi-Bae Choi, Yi-Bae Choi, Jung-Taek Oh, Jung-Taek Oh, "Projection moire for 3D inspection of printed circuit boards", Proc. SPIE 3023, Three-Dimensional Image Capture, (21 March 1997); doi: 10.1117/12.269750; https://doi.org/10.1117/12.269750
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