Satellite programs are moving in the direction of smaller and lighter structures. Technological advances have permitted more sophisticated equipment to be consolidated into compact spaces. Micro-satellites, between 10 and 100 kg, will incorporate micro-electric devices into the lay-up of the satellite structure. These structures will be designed to carry load, provide thermal control, enhance damping, and include integrated passive electronics. These multifunctional structures offer lighter weight, reduced volume, and a 'smarter' overall package for incorporation of sensors, electronics, fiber optics, powered appendages or active components. McDonnell Douglas Corporation (MDC) has applied technology from the synthesis and processing of intelligent cost effective structures (SPICES) and independent research and development (IRAD) programs to the modular instrument support system (MISS) for multifunctional space structures and micro-satellites. The SPICES program was funded by the Defense Advanced Research Projects Agency (DARPA) to develop affordable manufacturing processes for smart materials to be used in vibration control, and the MISS program was funded by NASA-Langley. The MISS program was conceived to develop concepts and techniques to make connections between different multifunctional structures. MDA fabricated a trapezoidal carbon composite structure out of IM7/977-3 tape prepreg. Flex circuits, thermal and optical conduits were embedded to realize a utility modular connector. These provide electrical, thermal, optical and mechanical connections between micro- satellite components. A quick disconnect mount was also developed to accommodate a variety of devices such as solar arrays, power sources, thermal transfer and vibration control modules.