Design and process of a new DUV ARCH3 resist

N. R. Bantu; Brian Maxwell; Arturo N. Medina; Thomas R. Sarubbi; Medhat A. Toukhy; Hans-Thomas Schacht; Pasquale A. Falcigno; Norbert Muenzel; Klaus Petschel; Francis M. Houlihan; Omkaram Nalamasu; Allen G. Timko

doi:10.1117/12.275833

7 July 1997 Design and process of a new DUV ARCH3 resist

N. R. Bantu, Brian Maxwell, Arturo N. Medina, Thomas R. Sarubbi, Medhat A. Toukhy, Hans-Thomas Schacht, Pasquale A. Falcigno, Norbert Muenzel, Klaus Petschel, Francis M. Houlihan, Omkaram Nalamasu, Allen G. Timko

Author Affiliations +

Proceedings Volume 3049, Advances in Resist Technology and Processing XIV; (1997) https://doi.org/10.1117/12.275833
Event: Microlithography '97, 1997, Santa Clara, CA, United States

Abstract

A new concept for polymer design is described which can extend the utility of acetal chemistry in the development of advanced chemically amplified deep-UV resists for KrF excimer lasers. Many acetal blocked polymers only impart marginal thermal flow properties to the photoresist matrix. This polymer design concept can overcome this thermal flow deficiency and also improve photoresist contrast and resolution. This concept involves the formation of crosslinked acetal polymers from linear acetal blocked polymers via acid labile crosslinks. The resulting branched polymers have increased T_g and therefore impart improved thermal flow properties to the resist. Furthermore, the acid lability of the crosslinks results in a large molecular weight differential between exposed and unexposed areas of the resist leading to larger dissolution rate discrimination between exposed and unexposed regions. The ultimate result is improved resolution capability of the resist system. This design concept has been incorporated into the ARCH3 resist series.

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N. R. Bantu, Brian Maxwell, Arturo N. Medina, Thomas R. Sarubbi, Medhat A. Toukhy, Hans-Thomas Schacht, Pasquale A. Falcigno, Norbert Muenzel, Klaus Petschel, Francis M. Houlihan, Omkaram Nalamasu, and Allen G. Timko "Design and process of a new DUV ARCH3 resist", Proc. SPIE 3049, Advances in Resist Technology and Processing XIV, (7 July 1997); https://doi.org/10.1117/12.275833

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