7 July 1997 Effect of processing on the overlay performance of a wafer stepper
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Abstract
The effects of resist spinning, aluminum sputtering and chemical mechanical polishing on the observed alignment position in ASML wafer steppers are presented. Vector maps of the process induced alignment shifts are shown for various processing conditions. The deposition experiments are compared with simulations and a specially designed alignment system modeling program.
© (1997) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Peter Dirksen, Casper A. H. Juffermans, A. Leeuwestein, Kees A. H. Mutsaers, Tom A. M. Nuijs, Rudy J. M. Pellens, Robert Wolters, Jack Gemen, "Effect of processing on the overlay performance of a wafer stepper", Proc. SPIE 3050, Metrology, Inspection, and Process Control for Microlithography XI, (7 July 1997); doi: 10.1117/12.275950; https://doi.org/10.1117/12.275950
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