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7 July 1997 Alignment sensor corrections for tool-induced shift (TIS)
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As the most critical semiconductor device geometries shrink down to the quarter micron order, requirements for overlay accuracy also become increasingly critical in the actual semiconductor manufacturing process. Factors in overlay error (especially, alignment error) originate in the interaction of process and tool. It is therefore necessary to improve alignment accuracy from both the process and the tool sides. In an effort to solve this as a tool supplier, we at Canon must minimize tool factors to reduce alignment errors caused by the interaction of process and tool factors. We though that we needed some evaluation criteria with such interaction take into account, and redefined the concepts of tool induced shift and wafer induced shift as a criterion. This paper introduces these new concepts and discusses validity of the criteria showing experimental results of alignment accuracy implementing the idea in the real process.
© (1997) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Tsuneo Kanda, Kazuhiko Mishima, Eiichi Murakami, and Hideki Ina "Alignment sensor corrections for tool-induced shift (TIS)", Proc. SPIE 3051, Optical Microlithography X, (7 July 1997);

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