15 July 1997 Real-time infrared test set: assessment and characterization
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Abstract
During the past several years, the technology for designing and fabricating thermal pixel arrays (TPAs) using silicon micromachined CMOS devices has been developed to support the development of a real-time infrared test set (RTIR) for sensors and seekers. The TPA is a custom application- specific integrated circuit device that is fabricated using a low-cost commercial CMOS process. The RTIR is a compact, self-contained test instrument that is intended for test and evaluation of infrared systems in the field. This paper describes characterization of TPA pixels, including directional radiant intensity distribution, spatial radiance distribution, temperature distribution, cross talk, spectral radiance, air pressure effects, and rise and fall times.
© (1997) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
H. Ronald Marlin, H. Ronald Marlin, Richard L. Bates, Richard L. Bates, Miles H. Sweet, Miles H. Sweet, Rowena M. Carlson, Rowena M. Carlson, R. Barry Johnson, R. Barry Johnson, Diehl H. Martin, Diehl H. Martin, Ronald Chung, Ronald Chung, Jon C. Geist, Jon C. Geist, Michael Gaitan, Michael Gaitan, Charles D. Mulford, Charles D. Mulford, Eugene S. Zakar, Eugene S. Zakar, Robert J. Zeto, Robert J. Zeto, Russ Olson, Russ Olson, Gordon C. Perkins, Gordon C. Perkins, } "Real-time infrared test set: assessment and characterization", Proc. SPIE 3084, Technologies for Synthetic Environments: Hardware-in-the-Loop Testing II, (15 July 1997); doi: 10.1117/12.280947; https://doi.org/10.1117/12.280947
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