2 April 1997 Enhanced strength provision for laser-soldered joints in radio electronics
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Proceedings Volume 3091, Laser Applications Engineering (LAE-96); (1997) https://doi.org/10.1117/12.271794
Event: International Symposium on Intensive Laser Actions and Their Applications and Laser Applications Engineering, 1996, St. Petersburg-Pushkin, Russian Federation
Abstract
As a result of kinetics of computer simulation of soldered joints forming, practical investigations of soldering modes influence at the joints' strength and analysis of micro section metalographic specimens fulfilled with the aid of electronic microscope, the possibility of three-five fold enhancement of soldered joints strength in comparison with manual soldering. Technological process and automated equipment are developed for laser soldering of electronic components with planar leads at the printed circuit boards.
© (1997) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Alexander A. Allas, Victor Novosadov, "Enhanced strength provision for laser-soldered joints in radio electronics", Proc. SPIE 3091, Laser Applications Engineering (LAE-96), (2 April 1997); doi: 10.1117/12.271794; https://doi.org/10.1117/12.271794
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