28 July 1997 Dry etching with consideration to thicker reticle size
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Abstract
Studies of dry etching in consideration of thicker reticle size which was expected to be adopted for next reticle size were investigated with simulated plates. CD variation due to blanks thickness was evaluated in both of an electron beam and a laser beam reticle process with MoSiON embedded phase shift mask blanks by using a modifying magnetically enhanced RIE system (MEPS-6025) based on a method to predict surface voltage (Fig. 2). As blanks thickness increased up to 12.7 mm, CD variations were changed respectively (Fig. 5 and 6) along with surface bias voltage of blanks in discharge (Fig. 4). It was found that a bias voltage contribution between center and corner of the plate became closer corresponding to thickness of reticles size. Under this condition, 9 mm in thickness was found to be acceptable for dry etching process, because the effect of thickness may make discharge localize near by the substrate surface but any reason to deteriorate CDs could not appear in this feasibility study.
© (1997) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Eiichi Hoshino, Eiichi Hoshino, Hideaki Hasegawa, Hideaki Hasegawa, Kunio Shishido, Kunio Shishido, Nobuyuki Yoshioka, Nobuyuki Yoshioka, Satoshi Aoyama, Satoshi Aoyama, Atsushi Hayashi, Atsushi Hayashi, Takaei Sasaki, Takaei Sasaki, Michael Hiroyuki Iso, Michael Hiroyuki Iso, Yasuo Tokoro, Yasuo Tokoro, } "Dry etching with consideration to thicker reticle size", Proc. SPIE 3096, Photomask and X-Ray Mask Technology IV, (28 July 1997); doi: 10.1117/12.277254; https://doi.org/10.1117/12.277254
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