28 July 1997 New mask data processing system for ULSI fabrication
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A new mask data processing system which significantly reduces overhead time in internal data handling and total elapsed processing time has been developed. This system is designed with a new compact mask pattern database architecture, where all mask data processing steps are performed. Using this system, the total elapsed processing time of geometrical operations, optical proximity effect correction (OPC) and electron beam (EB) exposure system data conversion were improved by a factor of 3.7 compared to a conventional system. The actual processing time for a wiring layer of a 0.25 micrometer device was 3.5 hours. In this paper, details of the system design and application for actual 0.25 micrometer devices are further discussed.
© (1997) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Ryuji Takenouchi, Hidetoshi Ohnuma, Isao Ashida, Satoru Nozawa, "New mask data processing system for ULSI fabrication", Proc. SPIE 3096, Photomask and X-Ray Mask Technology IV, (28 July 1997); doi: 10.1117/12.277293; https://doi.org/10.1117/12.277293


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