18 August 1997 Design of a laser cutting system at large distance by a synthetic aperture diffractive optical system in reflection mode
Author Affiliations +
Proceedings Volume 3097, Lasers in Material Processing; (1997) https://doi.org/10.1117/12.281093
Event: Lasers and Optics in Manufacturing III, 1997, Munich, Germany
Abstract
Laser material processing by the mean of Diffractive Optical Elements (DOEs) is a promising field, that has not yet entered the industrial world, except for hybrid on-axis spherical or aspherical lenses fabricated by diamond turning. Laser cutting, engraving, welding, and heat treatment are several applications among the potential of numeric-type beam shaping DOEs, designed and optimized by iterative algorithms and fabricated by microlithographic techniques. However, these DOEs have to be etched within materials which should withstand very high energy distributions (either from YAG, CO2 or Excimer lasers). Typical physical DOE configurations in transmission mode are etched ZnSe, ZnS, Ge substrates or even Quartz substrates, and in reflection mode, Au or Al coated etched substrates, blank etched Quartz substrates (YAG), or even SiC etched substrates.
© (1997) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Bernard C. Kress, G. Tahmouch, Patrick Meyrueis, "Design of a laser cutting system at large distance by a synthetic aperture diffractive optical system in reflection mode", Proc. SPIE 3097, Lasers in Material Processing, (18 August 1997); doi: 10.1117/12.281093; https://doi.org/10.1117/12.281093
PROCEEDINGS
4 PAGES


SHARE
RELATED CONTENT

Optical design of static and dynamic laser beam shaping systems
Proceedings of SPIE (September 23 2015)
Design of a three field-of-view IR system
Proceedings of SPIE (March 12 2008)
Industrial lasers in Japan
Proceedings of SPIE (March 01 1991)
Injecting a pulsed YAG laser beam into a fiber
Proceedings of SPIE (May 15 1997)
The Evolution Of Laser Machining And Welding,With Safety
Proceedings of SPIE (October 07 1980)

Back to Top