18 August 1997 Optimization of microchannel heat sinks for high-power diode lasers in copper technology
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Proceedings Volume 3097, Lasers in Material Processing; (1997); doi: 10.1117/12.281119
Event: Lasers and Optics in Manufacturing III, 1997, Munich, Germany
Abstract
Basis of the developments discussed in the presentation are 10 mm GaAs diode laser bars mounted on copper micro channel heat sinks. Optimizing the micro channel heat sinks leads to decreased thermal resistance and decreased pressure drop. In the presentation the steps to ten times reduced pressure drop and optical power output of the diode lasers of over 100 Watts will be described.
© (1997) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Thomas Ebert, Jens Biesenbach, Hans-Georg Treusch, Peter Loosen, Reinhart Poprawe, "Optimization of microchannel heat sinks for high-power diode lasers in copper technology", Proc. SPIE 3097, Lasers in Material Processing, (18 August 1997); doi: 10.1117/12.281119; https://doi.org/10.1117/12.281119
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KEYWORDS
Copper

Resistance

Semiconductor lasers

Laser applications

High power lasers

Gallium arsenide

Continuous wave operation

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