17 September 1997 3D-deformation analysis of microcomponents using digital holography
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Proceedings Volume 3098, Optical Inspection and Micromeasurements II; (1997) https://doi.org/10.1117/12.281183
Event: Lasers and Optics in Manufacturing III, 1997, Munich, Germany
Abstract
Holographic interferometry is widely used as contactless method in experimental mechanics and non-destructive testing of materials and engineering components. But measuring the full 3D-deformation of the object's surface requires a complicated optical setup with at least three different illumination directions.Especially if micro-components with lateral extensions less than 10mm have to be examined the simple use of conventional holography becomes more and more a problem. Since high resolution CCD cameras are available for reasonable prices, digital holography can be used as a fast, easy and precise method for holographic interferometry. Compact and simple setups can be achieved by the use of fiber optics. Digital holography replaces the holographic plate by a CCD matrix. No additional magnifying optical components are needed to achieve lateral resolutions of about 5 micrometers and deformation resolution of 15nm. Some experiments using four illumination direction in an optimized setup are presented. They show the 3D-deformation fields of small objects under a given load. The results are compared with computer simulations to receive material parameters.
© (1997) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Soenke Seebacher, Soenke Seebacher, Wolfgang Osten, Wolfgang Osten, Werner P. O. Jueptner, Werner P. O. Jueptner, } "3D-deformation analysis of microcomponents using digital holography", Proc. SPIE 3098, Optical Inspection and Micromeasurements II, (17 September 1997); doi: 10.1117/12.281183; https://doi.org/10.1117/12.281183
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