23 October 1997 Robust packaging of photonic rf modules using ultrathin adaptive optical interconnect devices
Author Affiliations +
Abstract
Ultra-thin, electrically programmable, low control power optical devices are proposed as adaptive optical alignment correction devices for future deployable photonic modules for RF signal processing applications. A substantial relative optical/RF gain (i.e., 7.92 dB RF gain) in a free- space PDL that requires a fiber remoted feed in the infrared 1300 nm optical spectrum has been successfully demonstrated.
© (1997) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Nabeel A. Riza, ShiFu Yuan, "Robust packaging of photonic rf modules using ultrathin adaptive optical interconnect devices", Proc. SPIE 3160, Optical Technology for Microwave Applications VIII, (23 October 1997); doi: 10.1117/12.283941; https://doi.org/10.1117/12.283941
PROCEEDINGS
8 PAGES


SHARE
KEYWORDS
Adaptive optics

Optical interconnects

Free space optics

Packaging

Connectors

Wavefronts

Fiber optics

RELATED CONTENT

Deformable mirror technologies at AOA Xinetics
Proceedings of SPIE (May 07 2013)
A hard x ray split and delay unit for the...
Proceedings of SPIE (October 08 2014)
Laboratory test of a pyramid wavefront sensor
Proceedings of SPIE (July 07 2000)

Back to Top