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21 November 1997 Three-dimensional thermal field analysis using a rotating interferometer
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A 3D thermal field has been analyzed using a rotating interferometer. By rotating, the interferometer the multi- direction interferograms of the tested field are captured by a CCD-computer system and stored into computer. After processing multi-direction interferograms by the image- processing and reconstruction software the multi-direction data are obtained. The multi-layer thermal field distributions are reconstructed using the same software. All process is finished within a few minutes and a complete 3D thermal field is obtained. The result is well fit to the conclusion gained by thermocouple.
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Zhengdong Wang, Dapeng Yan, Wei Yao, and Anzhi He "Three-dimensional thermal field analysis using a rotating interferometer", Proc. SPIE 3172, Optical Technology in Fluid, Thermal, and Combustion Flow III, (21 November 1997);

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