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Advanced lithographic methods for 300-nm contact patterning over severe topography with i-line stepper
Comparison of different optical proximity correction models with three-dimensional photolithography simulation over planar substrates
Analyzing the tolerance and controls on critical dimensions and overlays as prescribed by the National Technology Roadmap for Semiconductors
Best process focus and machine focus: adding focus offset to optimize photolithography process for VLSI manufacturing
Resist profile and CD control improvement by using optimized resist thickness and substrate film stack ratio for 0.35-um logic process
Effect of argon or nitrogen preamorphized implant on SALICIDE formation for deep submicron CMOS technology