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Controlled thickness and dielectric constant titanium-doped SiO2 thin films on silicon by sol gel process
Preparation, structure, and properties of aluminium nitride (AIN) reinforced polymer composites: alternative substrate materials for microelectronic packaging
Compression-molded three-dimensional tapered polymeric waveguides for low-loss optoelectronic packaging
Reversible low-temperature direct bonds for fabrication of three-dimensional microelectronic structures