18 August 1997 Audible acoustic wave real-time monitoring in laser processing of microelectronic materials
Author Affiliations +
Proceedings Volume 3184, Microelectronic Packaging and Laser Processing; (1997) https://doi.org/10.1117/12.280568
Event: ISMA '97 International Symposium on Microelectronics and Assembly, 1997, Singapore, Singapore
Abstract
Audible acoustic wave generation during KrF excimer laser processing of microelectronic materials Si, Cu and Al is investigated. It is found that amplitude of the acoustic wave is closely related to laser pulse number and laser fluence. Due to the laser cleaning of surface contamination, the amplitude reduces to a steady level with laser irradiation up to a pulse number of 10. The first peak-to- peak amplitude of the acoustic wave at the steady condition is used to evaluate laser interaction with the materials. The amplitude analysis shows that there exists a threshold fluence. For laser fluence higher than the threshold, the amplitude increases with laser fluence. Threshold fluences are 1.1, 1.35 and 1.2 J/cm2 for Si, Cu and Al respectively. It also shows that the increase of the amplitude starts to saturate for laser fluence higher than 10 J/cm2. According to ablation rate measurement, these thresholds of fluences are the same as the ablation thresholds of the materials. Saturation of amplitude increase is due to plasma shielding effect during the laser ablation of the materials. Theoretical calculation agrees well with the experimental result. Acoustic wave measurement provides a simple method to detect the threshold fluences of laser ablation and plasma shielding. By proper calibration, it can also be used as a real-time measurement of laser ablation rate. By applying appropriate pulse number, the laser processing of microelectronic materials can be controlled in-situ.
© (1997) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Minghui Hong, Yongfeng Lu, Wen Dong Song, Daming Liu, Tohsiew Low, "Audible acoustic wave real-time monitoring in laser processing of microelectronic materials", Proc. SPIE 3184, Microelectronic Packaging and Laser Processing, (18 August 1997); doi: 10.1117/12.280568; https://doi.org/10.1117/12.280568
PROCEEDINGS
10 PAGES


SHARE
RELATED CONTENT

Surface treatment by excimer laser
Proceedings of SPIE (August 16 2000)
Steam-assisted laser ablation of metal substrate
Proceedings of SPIE (February 25 2002)
High repetition rate femtosecond laser processing of metals
Proceedings of SPIE (February 25 2010)
Thin-film selective multishot ablation at 248 nm
Proceedings of SPIE (December 01 1991)

Back to Top