Paper
18 August 1997 Excimer laser in industrial material processing
Wilhelm F. Staudt, Heinrich Endert, V. Pfeufer
Author Affiliations +
Proceedings Volume 3184, Microelectronic Packaging and Laser Processing; (1997) https://doi.org/10.1117/12.280573
Event: ISMA '97 International Symposium on Microelectronics and Assembly, 1997, Singapore, Singapore
Abstract
Excimer laser have developed from physicists' 'toys' to powerful manufacturing tools, offering unique benefits to a wide range of applications. Nearly all technical and biological/medical materials can be structured by the intensive UV light. In the year 1997 the number of installations on manufacturing floors will be much higher than ever before. Besides the medical uses the most important applications are DUV lithography, TFT annealing for flat panel displays and microdrilling of hole arrays, especially for ink jet printer heads and or microelectronics packaging. This paper will present three main reasons of this breakthrough: The first is in the regard to the performance of the excimer laser itself. Technology developments by laser manufacturers have resulted in remarkable improvements in component lifetime, reliability, cost of ownership and ease of use. With gas lifetimes in excess of 108 pulses, laser tube exchange intervals longer than 5 X 109 pulses and integration of internal halogen generators quasi sealed-off excimer laser with hands-free operation are accomplished. The actually introduced NovaLine technology combines the experience of more than 4000 installed excimer laser with a completely new laser engineering. The second topic is a much more efficient way of using the UV photons. Progress in UV optics will be demonstrated with advanced approaches for beam delivery systems for i) drilling of interconnections in electronic packaging, ii) processing of micronozzle arrays for ink jet printers, and iii) line-beam-optics for scanning applications, especially for annealing of TFT's for AMLCD flat panel displays. The final reason is the achieved application performance itself, which will be shown with actual results.
© (1997) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Wilhelm F. Staudt, Heinrich Endert, and V. Pfeufer "Excimer laser in industrial material processing", Proc. SPIE 3184, Microelectronic Packaging and Laser Processing, (18 August 1997); https://doi.org/10.1117/12.280573
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Excimer lasers

Laser development

Manufacturing

Materials processing

Annealing

Flat panel displays

Laser applications

RELATED CONTENT

Laser applications in advanced chip packaging
Proceedings of SPIE (March 14 2016)
Excimer lasers in manufacturing
Proceedings of SPIE (March 27 1997)
Advanced-UV excimer laser processing
Proceedings of SPIE (February 19 2009)

Back to Top