The recent low price trend of electronic products has made IC manufacturing efficiency a top priority in the semiconductor industry. Post mold cure (PMC) process, which generally involves heating the packages in the oven at 175 C for 4 to 8 hours, takes up much longer time than most other assembly processes. If this PMC process can be reduced or eliminated, semiconductor makers will be rewarded with a much higher cost merit. We define the purpose of Non-PMC as 'to get high reliability with suitable physical and electrical properties without PMC'. We compared carious properties of molding compound before and after PMC. We found that curing reaction has almost complete through DSC and C-NMR measurement, but several properties have not stabilized yet, and that not all properties after PMC were better than before PMC. We developed new grade of molding compound considering these facts. And we found that main factors to accomplish non-PMC compound are curability and flowability, and more, increasing of fundamental properties. To accomplish non-PMC, at first, molding compound need to have very high curability. Generally speaking, too high curability causes low flowability, and causes incomplete filing, wire sweep, pad shift, and weak adhesion to inner parts of IC packages. To prevent these failures, various compound properties were studied, and we achieved in adding good flowability to very high curable molding compound. Finally, anti-popcorn property was improved by adding low moisture, high adhesion, high Tg, and high flexural strengths at high temperature. Through this study, we developed new compound grade for various package, especially large QFP using standard ECN resin.