18 August 1997 Reliability study of microelectronic packaging assemblies by a multiaxial submicron fatigue tester
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Proceedings Volume 3184, Microelectronic Packaging and Laser Processing; (1997) https://doi.org/10.1117/12.280581
Event: ISMA '97 International Symposium on Microelectronics and Assembly, 1997, Singapore, Singapore
Abstract
Existing mini testers are mostly single axial without any active specimen alignment monitoring and adjustment capability. Fundamental investigation for packaging materials needs to be conducted in terms of constitutive laws, fracture process, failure quantities. For the first time, specimen alignment monitoring and adjustment was demonstrated for a single lap shear sample by the 6-axis mini tester and its associated alignment monitoring and control system, assisted by a high resolution laser moire measurement. This paper presents results for two types of polyimide films, one led-free solder alloy, some other conventional materials, and a flip-chip assembly subjected to a three points bending. Various mechanisms of deformation and failure for both the materials and structures have been discussed. In particular, a new constitutive model for polymer films is also proposed in this paper.
© (1997) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Sheng Liu, Minfu Lu, Zhengfang Qian, Wei Ren, "Reliability study of microelectronic packaging assemblies by a multiaxial submicron fatigue tester", Proc. SPIE 3184, Microelectronic Packaging and Laser Processing, (18 August 1997); doi: 10.1117/12.280581; https://doi.org/10.1117/12.280581
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