Translator Disclaimer
18 August 1997 3D visual inspection of IC bonding wires
Author Affiliations +
Proceedings Volume 3185, Automatic Inspection and Novel Instrumentation; (1997)
Event: ISMA '97 International Symposium on Microelectronics and Assembly, 1997, Singapore, Singapore
During the stage of pre-cap inspection, 3D profiles of bonded wires are inspected to detect defects such as lifted, tight and sagging wires, and to measure the maximum wire height. This paper presents a novel inspection system based on the application of the stereo technique. In our single- camera setup, stereo views are obtained by rotating the IC chip under the camera. Wire bond edges are detected using Canny's method. These are then linked to form curves, and matching is conducted between two curve lists of a stereo pair. Results of local matching are combined to find the global optimum. The depth measurement of our system has an accuracy of 14 micrometers , which corresponds to one-fortieth of the total range of wire height.
© (1997) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Sim Heng Ong, X. Q. Han, and Q. Z. Ye "3D visual inspection of IC bonding wires", Proc. SPIE 3185, Automatic Inspection and Novel Instrumentation, (18 August 1997);


Back to Top