18 August 1997 Automated inspection and dimension measurement of optoelectronic components
Author Affiliations +
Proceedings Volume 3185, Automatic Inspection and Novel Instrumentation; (1997) https://doi.org/10.1117/12.284044
Event: ISMA '97 International Symposium on Microelectronics and Assembly, 1997, Singapore, Singapore
We report on the development of an automated inspection and dimension measurement system for optoelectronic components. Images of the components are captured with a CCD camera. Precision templates are designed for image calibration, and a sub-pixel detection software is developed for dimension measurement. Experimental results demonstrate that the system is capable of measuring the dimensions with an accuracy of 30 micrometers .
© (1997) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Tuan-Kay Lim, Tuan-Kay Lim, Sundaram Swaminathan, Sundaram Swaminathan, C. K. Woo, C. K. Woo, C. N. Chan, C. N. Chan, J. Y. K. Wong, J. Y. K. Wong, } "Automated inspection and dimension measurement of optoelectronic components", Proc. SPIE 3185, Automatic Inspection and Novel Instrumentation, (18 August 1997); doi: 10.1117/12.284044; https://doi.org/10.1117/12.284044

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