Paper
18 August 1997 Thinning by the motion of the structuring element for 3D inspection
Chun-Wai Hui, Lee Ming Cheng
Author Affiliations +
Proceedings Volume 3185, Automatic Inspection and Novel Instrumentation; (1997) https://doi.org/10.1117/12.284043
Event: ISMA '97 International Symposium on Microelectronics and Assembly, 1997, Singapore, Singapore
Abstract
In pixel based setting, thinning is often accomplished by removing contour points in connected regions iteratively. Such algorithms require the image be presented in a regular spatial grid. Missing data points are not allowed. In range data processing, such requirements are not always fulfilled due to reflectance and sensor geometry. An algorithm is developed for extraction and thinning of 3D linear features. It is based on fitting of structuring element. The data is assumed to be 3D measurement points of the objects of interest. Three criteria are employed to extract and simplified the required linear feature. First, connected point sets are identified. For each connected set, an occurrence of linear structure is then located by fitting a cylindrical structuring element. Finally, the complete linear feature is identified by motion of the structuring element along the major axis. This algorithm is useful for 3D inspection.
© (1997) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Chun-Wai Hui and Lee Ming Cheng "Thinning by the motion of the structuring element for 3D inspection", Proc. SPIE 3185, Automatic Inspection and Novel Instrumentation, (18 August 1997); https://doi.org/10.1117/12.284043
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KEYWORDS
Inspection

3D metrology

Algorithm development

Data processing

Feature extraction

Reflectivity

Sensors

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