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2 January 1998 Low-temperature direct bonding technology in photonic devices
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Proceedings Volume 3211, International Conference on Fiber Optics and Photonics: Selected Papers from Photonics India '96; (1998) https://doi.org/10.1117/12.345380
Event: International Conference on Fiber Optics and Photonics: Selected Papers from Photonics India '96, 1996, Madras, India
Abstract
Photonic Devices inherently have demanding materials requirements. The demanding needs of photonic devices generally require both large variations direct bandgaps and a large changes in the index of refraction in the materials used in their construction. Unfortunately, nature generally does not accommodate the material needs of these devices. It is generally difficult, if not impossible, to combine materials with the desired bandgaps and indices of refraction in a homogeneous structure formed by epitaxial growth techniques. Bonding has thus become an important technique to combine the required materials to achieve the features needed to create photonic devices.
© (1998) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Robert W. Bower "Low-temperature direct bonding technology in photonic devices", Proc. SPIE 3211, International Conference on Fiber Optics and Photonics: Selected Papers from Photonics India '96, (2 January 1998); https://doi.org/10.1117/12.345380
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