Visit My Account to manage your email alerts.
Correlation between aluminum alloy sputtering target metallurgical characteristics, arc initiation, and in-film defect intensity
Productivity enhancement by replacing photoresist etchback by chemical-mechanical polishing for interlayer dielectric planarization
Study of wetting properties of Ti/TiN liners deposited by ion metal plasma PVD for low-temperature sub-0.25-um Al fill technology
Statistical design of experimental analysis of TiN films deposited by ion metal plasma PVD for sub-0.25-um IC process applications
Removal of surface oxide from electrical test (E-test) pads using an argon sputter etch procedure to recover TAB wafers