5 September 1997 Advanced PVD Ti/TiN liners for contact and via applications
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Abstract
The benefits of different advanced PVD methods for Ti/TiN films, collimated, longthrow and ionized PVD, are compared to conventional or standard magnetron sputtering with respect to future requirements. Special attention is given to integration aspects in combination with W- plugs and hot Al-fill techniques for contact applications. Besides basic film properties and step coverage data, electrical results for contacts are reported. The dependence of the contact resistance on the bottom Ti thickness is explained, and a new spiking model for Al-filled contacts is proposed. Finally specific manufacturing issues like throughput, target life time and defect densities will be addressed also.
© (1997) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Hans-Joachim Barth, Hans-Joachim Barth, J. Bierner, J. Bierner, Hans Helneder, Hans Helneder, Werner K. Robl, Werner K. Robl, K. Schober, K. Schober, Manfred Schneegans, Manfred Schneegans, "Advanced PVD Ti/TiN liners for contact and via applications", Proc. SPIE 3214, Multilevel Interconnect Technology, (5 September 1997); doi: 10.1117/12.284651; https://doi.org/10.1117/12.284651
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