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11 September 1997 Die allocation optimization for yield improvement
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Abstract
The way in which dies are allocated within a wafer is the subject of this paper. Standard ways of doing it are based on a software program, mainly in-house built, that uses default values for all the variables and do not take into account, in a direct mode, the actual distribution of yield versus distance to wafer edge in the manufacturing line where the chip is to be manufactured. We present a novel Software System for die allocation in the wafer, that uses an empirically obtained Yield Distribution Function (which gives the normalized yield for every X Y coordinate over the entire wafer area). The software developed gives as output the optimum die allocation in terms of yield.
© (1997) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Carlos Ortega, Miguel Recio, Alfonso Urquia, Guillermo Sanchez, Ubaldo Nogal, and Alfonso Badillo "Die allocation optimization for yield improvement", Proc. SPIE 3216, Microelectronic Manufacturing Yield, Reliability, and Failure Analysis III, (11 September 1997); https://doi.org/10.1117/12.284690
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