Paper
5 September 1997 Automotive applications for micromachining
Author Affiliations +
Proceedings Volume 3223, Micromachining and Microfabrication Process Technology III; (1997) https://doi.org/10.1117/12.284483
Event: Micromachining and Microfabrication, 1997, Austin, TX, United States
Abstract
High volume silicon micromachining has been employed by the automotive industry for 20 years. This paper examines past, current and future applications of MEMS to the automobile. Both sensor and the application of micromachining to other automotive areas are covered. Technologies such as wet and plasma etching, wafer bonding, LIGA, circuit integration and packaging are discussed.
© (1997) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Douglas R. Sparks and Shih-Chia Chang "Automotive applications for micromachining", Proc. SPIE 3223, Micromachining and Microfabrication Process Technology III, (5 September 1997); https://doi.org/10.1117/12.284483
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CITATIONS
Cited by 3 scholarly publications.
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KEYWORDS
Micromachining

Integrated circuit design

Integrated circuit packaging

Integrated circuits

Microelectromechanical systems

Packaging

Plasma etching

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