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5 September 1997 Micromechanical structures and microelectronics for acceleration sensing
Brady R. Davies, Stephen Montague, James H. Smith, Mark Lemkin
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Proceedings Volume 3223, Micromachining and Microfabrication Process Technology III; (1997) https://doi.org/10.1117/12.284486
Event: Micromachining and Microfabrication, 1997, Austin, TX, United States
Abstract
MEMS is an enabling technology that may provide low-cost devices capable of sensing motion in a reliable and accurate manner. This paper describes work in MEMS accelerometer development at Sandia National Laboratories. This work leverages a process for integrating both the micromechanical structures and microelectronics circuitry of a MEMS accelerometer on the same chip. The design and test results of an integrated MEMS high-g accelerometer will be detailed. Additionally a design for a high-g fuse component (low-G or approximately equals 25 G accelerometer) will be discussed in the paper (where 1 G approximately equals 9.81 m/s). In particular, a design team at Sandia was assembled to develop a new micromachined silicon accelerometer which would be capable of surviving and measuring high-g shocks. Such a sensor is designed to be cheaper and more reliable than currently available sensors. A promising design for a suspended plate mass sensor was developed and the details of that design along with test data will be documented in the paper. Future development in this area at Sandia will focus on implementing accelerometers capable of measuring 200 kilo-g accelerations. Accelerometer development at Sandia will also focus on multi-axis acceleration measurement with integrated microelectronics.
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Brady R. Davies, Stephen Montague, James H. Smith, and Mark Lemkin "Micromechanical structures and microelectronics for acceleration sensing", Proc. SPIE 3223, Micromachining and Microfabrication Process Technology III, (5 September 1997); https://doi.org/10.1117/12.284486
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KEYWORDS
Microelectronics
Microelectromechanical systems
Sensors
Silicon
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