Translator Disclaimer
5 September 1997 IC microtransducers: new components with old materials?
Author Affiliations +
Proceedings Volume 3224, Micromachined Devices and Components III; (1997)
Event: Micromachining and Microfabrication, 1997, Austin, TX, United States
In the first part of this paper, we review the integration of MEMS and CMOS microtransducer technology and out-line the related IC MEMS CAD tools SOLIDIS and ICMAT. The IC microtransducer approach is illustrated by deflectable micromirrors, infrared sensors, and a thermally isolated n- well CMOS device. In the second part, we report two novel chemical microsensors based on CMOS MEMS technology: (i) a piezoresistive resonating beam with hydrocarbon-sensitive polymer layer and (ii) a microsystem chip including a piezoresistive and capacitive chemical sensors with co- integrated heating deice and circuitry.
© (1997) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Henry Baltes, Dirk Lange, and Andreas Koll "IC microtransducers: new components with old materials?", Proc. SPIE 3224, Micromachined Devices and Components III, (5 September 1997);

Back to Top